This invention provides a method of ultrasonic vibration grinding of Sapphire rod. Sapphire artifacts blank directed Hou will Shang, and Xia surface mill flat, with wax rubber bond in electric wood Shang, again will electric wood fixed in machine work stage; open ultrasonic, in 17kHz-23kHz Zhijian regulation ultrasonic frequency, makes its in resonance State; open cooling liquid, used within cooling and outside cooling mixed way on artifacts for cooling; for Ultrasound vibration grinding processing; processing completed Hou, will Sapphire artifacts together with electric wood with put in furnace Shang, heating to 115 ℃-125 ℃, Sapphire artifacts removed from the wood, which are 20-140mm in diameter, Sapphire rods of length 50-150mm. The invention has a surface are of good quality, low cost, has a broad prospect, can create significant social and economic benefits.
Sapphire-Rod method of ultrasonic vibration grinding
(A) the technical field of the invention belongs to a material processing method, specifically using ultrasonic vibration grinding method.
(B) background currently, Sapphire rods, mainly through the thin-walled diamond grinding together. Due to the high hardness of Sapphire materials, processing when Sapphire Rod using this method, not only the efficiency is very low, grinding wheels easy to plug, and wear of the grinding wheel, need regular repair and replacement grinding wheels and poor surface roughness, need more subsequent polishing time. Thus this long production period, the cost is high enough, can no longer meet the requirements of modern production.
(C) the purpose of the invention the present invention is to provide a way to improve the surface quality and shorten production cycles, increase productivity, reduce production cost method of ultrasonic vibration grinding of Sapphire rod.
This invention of purpose is such achieved of: 1, and Sapphire artifacts blank directed Hou will Shang, and Xia surface mill flat, with wax rubber bond in electric wood Shang, again will electric wood fixed in machine work stage; 2, and open ultrasonic, in 17kHz-23kHz Zhijian regulation ultrasonic frequency, makes its in resonance State; 3, and open cooling liquid, used within cooling and outside cooling mixed way on artifacts for cooling; 4, and used grain degrees for 80-230#, and diameter for 20-140mm, and length for 50-150mm, and Wall thickness of hollow, thin-walled 0.6-1.5mm electroplated or sintered diamond tools with 800-4000r/min speed and feed along the z axis at a 2-5mm/min rate and fallback arrangement tool: the tool after each feeding 0.02mm, back 0.01mm at a 4-10MM/min rate, feed 0.2-2mm, 1000-3000mm/min back to the surface at a speed of more than 2mm, Then tool again to 1000-3000mm/min of speed into to to back back Qian location above 0.01mm continues to repeat above processing action, until processing completed, used cooling and outside cooling mixed way on artifacts for cooling; 5, and processing completed Hou, will Sapphire artifacts together with electric wood with put in furnace Shang, heating to 115 ℃-125 ℃, will Sapphire artifacts from electric wood Shang removed, which get diameter for 20-140mm, and length for 50-150mm of Sapphire Rod material.
The invention can include a number of features: 1, the wax adhesives is compounded by the following quality percentage: chips: 20%-40%, Rosin: 20%-30%, calcium carbonate, 20%-55%, 5%-10% castor oil.
2, the cooling is directly from a hollow diamond tool on the workpiece, the cooling is through the nozzle adjust the pouring position, coolant wall Jet along the diamond tools in the tool bottom workpiece.
The invention is installed in the spindle NC drilling machine using ultrasonic vibration grinding tools, hollow thin-walled diamond tools rotating at high speed at the same time, with a certain frequency and amplitude of ultrasonic vibration processing along the z axis. The invention of ultrasonic vibration grinding of Sapphire rods, is a combination of Ultrasonic machining and grinding compound machining method, the beneficial effects of the invention: using ultrasonic vibration grinding method, that is combination of Ultrasonic machining and grinding, efficiently create low cost, high quality Sapphire rods. And existing technology phase compared, this invention of main advantage is production efficiency high, than General grinding method efficiency about improve 5 times times; processing surface quality good, surface rough degrees can up Ra0.3-0.9 μ m; processing cost low, while is due to reduced has tool loss, extended has tool using life (than General grinding method about increased 10 times times), on the is due to processing surface quality good, shortened has follow-up of grinding polishing time. Therefore, the technology has broad application prospects, can create significant social and economic benefits.
(D) the specific implementations for example of the invention is described in more detail below: the specific way of implementing a: 1, Sapphire blanks the workpiece redirected the upper and lower surfaces smooth, use a wax adhesive on the bakelite, wood fixed to the machine table. Seal adhesive compounded percentage according to the following quality: chips: 20%-40%, Rosin: 20%-30%, calcium carbonate, 20%-55%, castor oil, 5%-10%;2, open, ultrasonic, 17kHz-23kHz between the ultrasonic frequency, so that it is in resonance State; 3, coolant supply method of internal cooling and cold are two ways; 4, programming and processing. Used grain degrees for 230#, and diameter for 20mm, and length for 50mm, and wall thick for 0.6mm of hollow thin-walled plating gold steel stone tool to 4000r/min speed rotating, while to 5mm/min of speed along z axis into to, and arrangements tool back back action: that tool each into to 0.02mm Hou, to 10MM/min of speed back back 0.01mm, tool each into to 0.5mm, to 800mm/min of speed back back to artifacts surface above 2mm, Then tool feed at 800mm/min speed to fall back position before 0.01mm continue to repeat the above process until finished; 5, after the processing is complete, Sapphire artifacts along with bakelite in the electric arc furnace, heated to 120 ℃, Sapphire artifacts can be removed from the bakelite, obtained 20mm diameter, length of 50mm Sapphire bar. Sapphire Rod surface roughness up to Ra0.3 μg of m,C-axis accuracy ± 0.05.